IMAPS Nordic
IMAPS Nordic
Keywords IMAPS, Nordic
36th Annual Conference conference programme
Sunday 19 September 1999
Tutorials:
08.30-12.30E. Jan Vardaman, TechSearch International, USA "Area array packages trends and applications: CSPs and BGAs".
13.30-17.30Dr Elke Zakel, PacTech GmbH, Germany "Flip chip technology".
08.30-17.30Michael Pecht, Calce, U. of Maryland "How to select and use electronic parts outside the manufacturer-specified temperature range".
Monday 20 September 1999
09.00-09.30IMAPS Nordic Annual Meeting, Paul Collander.
09.30-10.30Opening Session, Paul Collander.
09.30-09.35Paul Collander, IMAPS Nordic President, Nokia Research Center, Finland Opening.
09.35-10.00Heikki Huomo, VP R&T, Nokia Mobile Phones, Finland Keynote speech:"Packaging and interconnect getting a revenge".
10.00-10.30Exhibitors A run through the technical importance of what is on display in the exhibition.
10.30-11.00Coffee and exhibition.
M1
11.00-12.30High volume production, Sören Nörlyng, Katarina Boustedt.
E. Jan Vardaman, TechSearch International, USA "A market and technology analysis of high density substrates for IC packages".
Moses Chan CS2, Belgium "Effects of package construction on thermal performance of BT based ball grid array packages".
Kari Määttänen,Jouko Happonen and Aulis Tuominen, Nokia Display Products, Nokia Mobile Phones,Pori University, Finland "The size evolvement of LCD displays by packaging technology means".
12.30-13.30Lunch.
M2
13.30-15.00Integrated passives Paul Collander, Ivan Szendiuch.
Shaofang Gong,Björn Ekstrom, Johan Nilsson, Magnus Hörlin Olle-Jonny Hagel, IMC,Sweden "Evaluation of passive components and devices integrated in MCM-L and MCM-D substrates".
Robert Heistand II, David Liu, R. Moffatt Kennedy, George Korony, Joe Hock, Andy Ritter, AVX, USA "Advances in passive integrationfor C/RC arrays and networkswith novel thin and thick film materials".
S. Wijeyesekera, N. Patel, D.H. Bolton, P. Chang, H.M. Clearfield, Intarsia Corp.,USA "Development of wafer level packaging for integrated passive devices".
15.00-16.00Coffee and exhibition.
M3
16.00 - 18.00RF and millimeter wave Hans Danielsson, Henrik Hvims.
Philip Pieters, Walter DeRaedt, Eric Beyne, IMEC, Belgium "Advances in microwave MCM-D technology".
Peter Barnwell, Heraeus Inc., Cermalloy Division, UK/USA "A new, very low loss LTCC technology, combined with photo-patterned thick film for microwave applications".
Martin Oppermann, DaimlerChrysler Aerospace AG, Germany "Millimeter-wave modules and applications based on 3D packaging and multichip modules (MCMs)".
Hannu Ronkainen, Tarja Riihisaari, Hannu Kattelus, Arni Kujala, Jyrki Kaitila, VTT Electronics, Helsinki U. of Tech., Finland "MCM-D RF circuit block design".
20.00-23.00Banquet dinner.
Tuesday 21 September 1999
T1
08.30 - 10.00FlipChip and fine pitch BGA Katarina Boustedt, Sören Nörlyng.
Jarmo Määttänen,Petteri Palm, Elcoteq Network Corp., Finland "Development of flip chip on flex process using anisotropically conductive adhesives".
Peter Elenius,Jim Leal, Dave Stepniak, Shing Yeh, Flip Chip Technologies, Delphi Delco Electronics, USA "Recent Aadvances in flip chip wafer bumping using solder paste technology".
Simone Peters,Loctite Europe, UK "A roadmap to flip chip assembly using advanced adhesives".
10.00-11.00Coffee and exhibition.
T2
11.00 - 12.30Substrates Ivan Szendiuch, Paul Collander
David J.J. Lowrie, Mike G. Firmstone, Martin Bartholomew, Bill Green, Multicore Solders Ltd, ELPAC Inc., UK "The moulded electronic package (MEP)".
Arja Mehtäl,Nokia Research Center, Finland "Future challenges in printed wiring board technology".
A. Wolter, P. Kersten, Photo Print Electronic GmbH, Germany "Advanced microvia substrates for CSP and flip chip mounting".
12.30-13.00Lunch.
T3
13.30-15.30MEMS packaging Kenneth Dahlberg, Snorre Prytz.
Matthias Heschel, Peter T. Tang, Jochen F. Kuhmann, Siebe Bouwstra, Kurt Rasmussen,Mikroelektronik Centret, DTU, Microtronic A/S, Denmark "Multiple through-wafer interconnects for stacking of microsystems".
Outi Rusanen,VTT Electronics, Finland "MEMS packaging".
Staffan Karlsson, Stefan Johansson, Katarina Boustedt, Uppsala University, Ericsson Microwave Systems, Sweden "A new flexible building technique for microsystems".
Jon H. Ulvensøen,Grete Lill Karlsen, SensoNor asa, Norway "Packaging for volume production of micro electromechanical Ssystems a great challenge.
15.30-16.30Coffee and exhibition.
T4
16.30-18.30Ceramics still going strong Terho Kutilainen, Hans Danielsson.
Heiko Thust,Karl-Heinz Drüe, Torsten Thelemann, Technical University of Ilmenau,Germany "Trimming arrangement of buried resistors in LTCC".
Leon Balents,Herb Dwyer, Zecal Inc., USA "Plated copper on ceramic technology is introduced into RF and CSP packaging".
Hans Danielsson, Mikroelektronik Konsult, Sweden "SMT on ceramic for high reliability".
John Oleksyn,DuPont Electronics, UK "The utilisation of thick film Cu and Ag conductors in power applications".
19.00-21.00Buffet Dinner in Exhibition area.
Wednesday 22 September 1999
W1
08.00-10.00 Reliability assessment Snorre Prytz, Kenneth Dahlberg.
Dewei Tian,Risto Rautioaho, Seppo Leppävouri, University of Oulu, Finland "Inspection of microelectronics packaging using X-ray and scanning acoustic microscopes".
Esa Muukkonen, Pekka Pirttikoski, Aulis Tuominen, Pori University, Finland "Characterization of creep phenomenon in connection materials in advanced surface".
Horatio Quinones, Asymtek, USA "Reliability statistics for flip chip interconnections".
Virpi Pennanen, Markku Tammenmaa, Tommi Reinikainen, Jiansen Zhu, Wei Lin, Nokia Telecommunications, Nokia Research Center, Finland "Evaluation of TBGA interconnection reliability".
10.00-10.30Coffee.
W2
10.30-12.00Reliable organic materials Henrik Hvims, Terho Kutilainen.
Bart Vandevelde, IMEC, Belgium "The polymer stud grid array (PSGA) package".
Petteri Palm,Aulis Tuominen, Elcoteq, Pori University, Finland "The adhesion strength of underfill material to two solder resists in high humidity environment".
Magnus Törnvall,Peter Haglund, Jan-Olof Andersson, Combitech Electronics AB "Reliability of isotropic conductive adhesive joints to different surface and component metallizations in automotive applications".
12.00-12.15Closing session.
Further information is available from the IMAPS Nordic website: http://www.imapsnordic.a.se
