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Keywords: PQFN package
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2014) 31 (2): 129–136.
Published: 29 April 2014
... of the silicon die. Finally, an E-test verified that no wafer damage issue was found. PQFN package Wafer damage Wedge tool Al buildup FEA modeling WDT Figure 4 Wedge bond profile and WDT Figure 5 FEA model and result Figure 6 Wafer damage under wedge tool...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (3): 176–186.
Published: 26 July 2013
...Fei Zong; Zhi‐jie Wang; Yan‐bo Xu; Ji‐yong Niu; Han‐min Zhang Purpose The purpose of this paper was to attempt to confirm the root cause of unstable stitch pull strength in PQFN package and propose some permanent solutions for it. Design/methodology/approach A screen experiment was designed...
