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Keywords: Regression analysis
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Journal Articles
Thermal investigations of microelectronic chip with non‐uniform power distribution: temperature prediction and thermal placement design optimization
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2004) 21 (3): 29–43.
Published: 01 December 2004
... board was used for model validation. A fan heat sink was attached to the die using ShinEtsu G‐749 thermal grease as the thermal interface material. © Emerald Group Publishing Limited 2004 Programming and algorithm theory Finite element analysis Regression analysis Dissipation factor...
