... integrating advanced metallization, intelligent process control and nanoscale characterization, addressing the reliability challenges of wide bandgap ( WBG ) semiconductors, fine-pitch miniaturization (<40 µm) and harsh environment applications. Design/methodology/approach This critical synthesis...

...Xiaolong Zhang; Zihua Feng; Zicai Shen; Yang Liu; Guangbao Shan; Yuxiong Xue Purpose With the continuous increase in the power density of electronic devices, their risk of thermal failure has risen significantly, posing severe challenges to their reliability. Although microchannel cooling...

... rates, thereby enhancing the overall quality and reliability of bump interconnections in high-density integrated circuits. Design/methodology/approach Design of experiments ( DOE ) is used as the systematic approach. Key parameters, including under-bump metallurgy ( UBM ) dimensions, polyimide ( PI...

...Amer Mecellem; Soufyane Belhenini; Douaa Khelladi; Caroline Richard Purpose The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption...

...Fan Yang; Hao Chen; Shuai Xu Purpose Quantitative reliability analysis can effectively identify the time the driving system needs to be maintained. Then, the potential safety problems can be found, and some catastrophic failures can be effectively prevented. Therefore, this paper aims to evaluate...

...Xionghui Cai; Aixia Zhai; Chenglong Zhou; Kyung-Wook Paik Purpose The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system...

... is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages. Design/methodology/approach A 3D geometric model of SMT package is established. The mechanical...

... reliability of these inertial sensors in comparison to traditional iterative microfabrication and experimental characterization approach. Design/methodology/approach A dual-axis capacitive MEMS accelerometer design is presented considering the microfabrication process constraints of the foundry process...

...Ye Tian; Heng Fang; Ning Ren; Chao Qiu; Fan Chen; Suresh Sitaraman Purpose This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests...

...Sebastian Löffler; Christopher Mauermann; Angela Rebs; Günter Reppe Purpose The purpose of the paper is to show up the current possibilities by combination of classic thick-film technology with advanced processing. Thick-film hybrid ceramic substrates have been a base for highly reliable devices...

...Peyman Rafiee; Golta Khatibi; Michael Zehetbauer Purpose The purpose of this paper is to provide an overview of the major reliability issues of microelectromechanical systems (MEMS) under mechanical and environmental loading conditions. Furthermore, a comprehensive study on the nonlinear behavior...

.... The research on an accurate mathematical model of the CSP assembly prototype is a future work. Practical implications – It builds a basis for high reliability design of high-density CSP assembly for engineering application. In addition, vibration fatigue life prediction method of chip-corner solder balls...

... evaluated. Flip chips were assembled on test vehicles for temperature cycling and high‐temperature high‐humidity tests. The reliability performance of the processes was compared. Flip chip processes using NCA, ACF, or ACP could give satisfactory reliability and high assembly yield for some applications...

...Zhaowei Zhong A reliable packaging process for flip chip on ceramic substrate using gold bumps and adhesive was successfully developed. The bonding parameters and flip chip assemblies using four adhesive materials were investigated by means of design of experiments and yield runs. The packaging...

...Milos Dusek; Ivan Szendiuch; Petr Szuscik Investigates the influence of land pattern pad designs and solder volume on reliability of solder joint attachments for surface mounted passive chip devices. All boards were thermal cycled and periodically tested to induce a damage mechanism in less time...

... constant are determined to describe the curing progress. It is shown that the autocatalytic effect dominates the reaction kinetics. © MCB UP Limited 2000 Curing Underfill Encapsulant materials Reliability Solder joints In order to minimize the thermal stress, it is necessary to use...

...‐temperature high‐humidity tests. The reliability performance of the three processes (gold bumps with ACF, gold bumps with ACP, and eutectic solder bumps with underfill) is compared. as shown in Figure1. When ACP is used, there are only two process steps needed: 1. 1ACP placement; and 2...

.... ATC testing also included a rework cell. Overall, the PBGA module attachment process demonstrated robustness. The initial attach and reworked modules proved to be reliable. This paper focuses on the details of the test conditions and the results. © MCB UP Limited 1997 Plastic ball grid...

... of construction are recommended. Comparisons are made between package design for high power dissipation and that for high temperature operation. © MCB UP Limited 1996 Reliability Electronics packaging High temperature Microelectronics Traditionally, the maximum allowable operating...

... encapsulation as a flip‐chip underfill. The encapsulant matches the coefficient of thermal expansion(CTE) of C4 solder and minimises stresses on the interconnection. This enhancement provides a substantial reliability improvement in comparison with unencapsulated packages. Also, it enables larger die...