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Keywords: Solders
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Journal Articles
A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2012) 29 (1): 47–57.
Published: 20 January 2012
...Dhafer Abdul Ameer Shnawah; Mohd Faizul Bin Mohd Sabri; Irfan Anjum Badruddin; Suhana Said Purpose The purpose of this paper is to discuss the reliability of board level Sn‐Ag‐Cu (SAC) solder joints in terms of both thermal cycling and drop impact loading conditions, and further modification...
Journal Articles
Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2006) 23 (2): 37–44.
Published: 01 May 2006
...K.O. Lee; K.E. Ong; K.N. Seetharamu; I.A. Azid; G.A. Quadir; T.J. Goh Purpose Aims to present a finite element analysis based methodology for estimating the characteristic fatigue life of a solder joint interconnect under accelerated temperature cycling to predict the reliability performance...
Journal Articles
Reliability assessment for SnPb solder and Ag‐Pd bond pad metallization
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2005) 22 (2): 21–27.
Published: 01 August 2005
...Kiat Choon Teo; Yu Lin Ting Purpose To predict the reliability life for SnPb solder and Ag‐Pd bond pad metallization. The aim of selected artificial aging using temperature shock test (TST) and high temperature storage test (HTS). These tests are produced in a short time, the same deterioration...
