...Yuqi Wang; Ran Yao; Hui Li; Wei Lai; Wenqian Yuan; Yirun Ji; Qing Huai; Xi Yuan; Ziyao Jie Purpose This study aims to understand the phenomenon of stress relaxation in the gate pin of press-pack IGBT devices due to the coupling effect of electrical, thermal and mechanical fields, gate pin stress...

... the overall resistance to shear deformation, although with a higher buildup of local stresses. High shear and tensile stresses can develop in the intermetallic and nearby regions of copper and Si if the solder alloy is replaced by an intermetallic layer. The carrier mobility change in Si may be extensively...

...) motherboard is still rare. Therefore, the present study aims to investigate the fluid‐structure interaction (FSI) behaviors of the newly proposed FPCB motherboard under fan‐flow condition in the PC casings. Design/methodology/approach The deflection and stress induced, which are usually ignored...