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Keywords: System-in-package (SiP)
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Journal Articles
Fabio Santagata, Jianwen Sun, Elina Iervolino, Hongyu Yu, Fei Wang, Guoqi Zhang, P.M. Sarro, Guoyi Zhang
Journal:
Microelectronics International
Microelectronics International (2018) 35 (4): 231–243.
Published: 01 October 2018
...Fabio Santagata; Jianwen Sun; Elina Iervolino; Hongyu Yu; Fei Wang; Guoqi Zhang; P.M. Sarro; Guoyi Zhang Purpose The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators...
