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Keywords: TCR
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2017) 34 (3): 154–159.
Published: 07 August 2017
... metallization on its electric parameters and structure. On the basis of the research conducted, the existence of a relationship between resistance (R) and the temperature coefficient of resistance (TCR) of the test structure with a Ni-P alloy-based layer and the temperature of stabilization was proposed...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2014) 31 (3): 149–153.
Published: 04 August 2014
...Dr Agata Skwarek; P. Kowalik; Z. Pruszowski; J. Kulawik; Andrzej Czerwiński; Mariusz Pluska Purpose – This paper aims to select parameters such as temperature thermal stability and temperature coefficient of resistance (TCR) for Ni–P resistive alloys obtained by electroless metallization. Ni–P...
