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Keywords: Thermal performance
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Journal Articles
Effect of heat‐spreader sizes on the thermal performance of large cavity‐down plastic ball grid array packages ‐ NuCSP
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1999) 16 (2): 24–33.
Published: 01 August 1999
...) or 0.5mm (five‐row). Solder ball land diameter: 30mils (0.76mm). Solder mask opening for solder ball: 0.65mm. Single‐core two‐metal layer substrate. Cavity‐down design with heat spreader. Also, optimized electrical and thermal performance on the single‐core and double‐sided NuBGA...
Journal Articles
Thermal performance of a low‐cost thermal enhanced plastic ball grid array package ‐ NuBGA
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1998) 15 (2): 25–33.
Published: 01 August 1998
... substrate hampers the thermal performance of the NuBGA due to longer thermal path to transfer heat to PCB. (However, the difference of thermal resistances is less than 2 per cent when substrate thickness ranges from 0.5588mm to 0.762mm); 3. 3size of the PCB as well as number of power/ground planes...
