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Keywords: Thermal stabilization
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2017) 34 (3): 154–159.
Published: 07 August 2017
.... The process lasted 60 min, and the metallization bath pH was kept at 2.1-2.2, whereas the temperature was maintained at 363 K. The thermal stabilization process was conducted in different temperatures between 453 and 623 K. After the technological processes, the resistance and TCR of the test structures were...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2014) 31 (3): 149–153.
Published: 04 August 2014
...Dr Agata Skwarek; P. Kowalik; Z. Pruszowski; J. Kulawik; Andrzej Czerwiński; Mariusz Pluska Purpose – This paper aims to select parameters such as temperature thermal stability and temperature coefficient of resistance (TCR) for Ni–P resistive alloys obtained by electroless metallization. Ni–P...
