Keywords: Thermal stabilization
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Journal Articles
Microelectronics International (2017) 34 (3): 154–159.
Published: 07 August 2017
.... The process lasted 60 min, and the metallization bath pH was kept at 2.1-2.2, whereas the temperature was maintained at 363 K. The thermal stabilization process was conducted in different temperatures between 453 and 623 K. After the technological processes, the resistance and TCR of the test structures were...
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