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Keywords: Ultrasonic vibration
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2019) 36 (2): 62–67.
Published: 15 February 2019
... pull strength. Design/methodology/approach The in situ inspection of ultrasonic vibration waveform through the changes of vertical axis (y-axis) amplitude of wire bonder capillary was carried out using laser interferometer to analyze the formation of Au wedge bond...
