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Keywords: Wire bond reliability
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2016) 33 (1): 53–60.
Published: 04 January 2016
.../value – To resolve “lifted ball bond” issue, optimization of the bond pad surface quality and the wire bond parameter has been studied and reported in many studies, but the influence of ball bond diameter on wire bond reliability is rarely focused. Moreover, the observation of ball bonds randomly...
