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Although the subject discussed at this meeting is one in which I have a personal and commercial interest, I will try to report the meeting in an unbiased manner. I must, however, point out that I asked only one question at the meeting and that was when one of the speakers compared solder cream to sand. I believe this type of comment shows a complete misunderstanding of the sophisticated material that is today's solder cream and especially of solder cream designed for ‘fine‐pitch soldering’.
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© MCB UP Limited
1991
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