New Soldering Process Using Light Beam Technology Available to Purchase

Today, approximately three years since its development, the non‐contact micro soldering method (local soldering method) continues to be highly regarded due to its superiority over other soldering methods (i.e., soldering irons, etc.) and is being used in a wide range of applications in the industrial electronics field. This technology has been incorporated into the production lines of numerous plants worldwide including the USA and Japan. This paper focuses on introducing the following: (1) the micro spot soldering method, the method most frequently utilised in production lines; (2) the continuous soldering method newly developed for use with surface‐mount components such as connectors of PCMCIA memory cards; and (3) the upward soldering method in which the light beam is irradiated upward, enabling the components to be soldered without flipping printed circuit boards (PCBs). The paper will also include practical examples, the optimal circuit board design, and an evaluation of soldering quality.