New lightweight, low thermal expansion silicon-aluminium alloys
New lightweight, low thermal expansion silicon-aluminium alloys
Keywords Osprey Metals, Silicone, Alloys
A new range of Si/Al alloys containing up to 70%wt Si has been developed and commercialised by Osprey Metals (UK) using their patented, spray forming technology. The alloys are charactcrised by:
low densities, up to 15 percent lighter than pure AI;
low, controlled coefficients of thermal expansion, pre-selected in the range 6.5-12ppm/°C by varying alloy composition;
stable coefficients of expansion over a wide temperature range;
high stiffness;
high values of thermal conductivity (> 120 W/rnK).
Moreover, the alloys are non-toxic, readily machinable with carbide or PCD tooling, easily plateable with nickel, gold, silver and/or copper and provide shielding to EMI and RFI radiation. These properties make the alloys ideal choices for use in a wide variety of electronic applications, particularly where low density and low thermal expansivity are critical requirements in such industries as aerospace,defence, telecommunications, etc. Suitable applications include microwave housings, electro-optical housings, power IC packages, carrier plates, heat sinks and waveguide and microwave filter components, One major advantage of the new Si/A1 alloys for such applications is the ability to rapidly machine prototype components from blocks or plates of the material.
Further information is available from Dr Andrew Ogilvy (Europe), Osprey Metals Ltd, Millands, Neath SA11 1NJ, UK. Tel: +44 (0)1639 634 121; Fax: +44 (0)1639 630 100; E-mail: spray.form@ospreymetals.co.uk
