Issues

Appointments

MultiTroniKs Ltd appoints new regional sales manager

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Holloway rejoins Nepcon portfolio of events as director of industry development

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Quad appoints Mortensen director of international sales

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Quad Systems names Langbridge general manager and director of Quad Europe Limited

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DEK appoints new advanced technologies engineer

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DEK Asia Pacific appoint new general manager

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New European business manager for Speedline ELECTROVERT

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Kiwi takes flight and joins Multicore

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Book reviews

Chip Scale Packaging: Design, Materials, Processes and Reliability

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Electronic Failure Analysis Handbook

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Aqueous Cleaning Handbook

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PBGA solder ball coplanarity impact evaluation

Tony Huang; Joe Chu
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Materials behaviour and the reliability in performance of solder joints

W.J. Plumbridge
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Interfacial reactions of tin‐zinc‐bismuth alloys

Paul Harris
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Analysis of crack growth in solder joints

Dongkai Shangguan
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Characterization of a solder paste printing process and its optimization

Gary K.K. Poon; D.J. Williams
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Survey of rework practices in the UK electronics assembly industry

M. Wickham; C.P. Hunt
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Enhancement of underfill encapsulants for flip‐chip technology

M.B. Vincent; C.P. Wong
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Company profile

Philips Electronic Manufacturing Technology (EMT)

Trevor Galbraith
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Conferences

The Second International IEEE Symposium on Polymeric Electronics Packaging (PEP'99)

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Editorial

Editorial

David Topham
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Industry news

Flextronics International announces agreement for merger with Kyrel EMS Oyj

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Flextronics International completes acquisition of the Ericsson Visby, Sweden plant

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DEK signs AMTEST as their central European distributor

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Quad Systems finalizes distribution agreement with Mirae Corporation

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The inside story on design re-use and intellectual property

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New headquarters for Europlacer Group

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GenRad and Tecpro join forces in Ireland

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ITRI launch the first lead-free soldering technology centre

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More investment at DEK Screens

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New 1.4 million project aims to boost business opportunities for electronics industry

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OnQ Technology chosen as name for merged Cofer and Surface Mount Taping Corporations

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New trade fair for electronics in India

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PMJ wins orders worth over FIM 50 million

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PAF Systems appoints Irish distributor

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Speedline Technologies invests in new Asia/Pacific headquarters

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New analytical support service

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New MRSI European office opens

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Kestra Ltd of UK acquired by CyberOptics

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Speedprint acquired by Europlacer

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Indium Corporation awarded Market Engineering Award

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Institute news

SMTA. Anita Sargent named winner of the 1999 Hutchins Educational Grant

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IPC. IPC releases final financial statistics for 1998 EMSI market

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IPC. IPC to create roadmap for lead-free electronic assemblies

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IPC. IPC introduces lead-free alternative electronic forum

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SSTC. Full house at spring meeting of SSTC held at NPL

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IPC. IPC SMEMA Council to give two technical paper awards at APEX 2000

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IPC. IPC to 'storm' the shores of Long Beach with General H. Norman Schwarzkopf

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SMTA. SMTA hosts talk on packaging future

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SMTA. Real world BGA/CSP applications at Nepcon Texas

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IPC. Motorola VP to keynote IPCWorks '99

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IPC. IPCWorks '99 to focus on lead-free electronic assemblies

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International diary

International diary

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Internet commentary

As some day it may happen that a victim must be found, I've got a little list ­ I've got a little list(1)

Brian Ellis
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New products

Extended tack and stencil life solder paste

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FirstCheck speeds inspection, reduces downtime

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Launch of new industry standard for PCB reliability

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MYDATA increases component range for HYDRA

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New Ultra Fast(TM) UV curing adhesives

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PMJ's automation of the final assembly process

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GR TestStation enhancements expand system flexibility and capability

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New via plug ink enables void-free hole filling

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Senju Europe launches high performance solder paste resistant to tombstoning

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Launch of affordable system for BGA inspection

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New PCB transport system from Siemens increases throughput significantly

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Pin-ball wizardry from Autosplice

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MYDATA releases two new placement machines - MY9 and MY12

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AutoLSM semi-automatic solder paste inspection

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Enhancements to Teradyne's flying prober provide faster board test to meet manufacturing demands of shorter new product life cycles

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Enhancements to Genrad's CIMBridge software expand Fuji programming capability through Fujicam

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Siemens rolls out faster, more flexible SIPLACE SMT machine

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ProFlow continues to evolve

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Speedline launches high-speed flexible wave soldering system

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New lightweight, low thermal expansion silicon-aluminium alloys

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New Speedline MPM software package

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New high-speed, user-friendly wave soldering system from Speedline ELECTROVERT

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New AAT Hydrojet brings high speed, state-of-the-art performance to 'in-line' cleaning

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Teradyne to extend Unified Test Environment with new platform configurations

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Multi-handshaking makes conveyors universal tank

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Multicore solders announces CM50 contaminometer for large PCBs

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New polyurethane encapsulant from Multicore

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New 'no flow' flip-chip underfill dramatically improves joint yield

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New Quad Meridian Series(TM) SMT assemblers significantly expand quad market presence

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Scanner technology cuts PCB inspection time to just a minute

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SMART news

SMART Group Ireland

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SMART Group rework seminar/workshop - 13th May 1999, Coventry

Mike Judd; Tom Perrett
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SMART Group trip to Productronica

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Industry welcomes lead-free guidance

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SMART Group Scotland - corporate golf day

Jim Wilson
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SMART Ireland host golf and shooting event

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Soldering & Surface Mount Technology sponsor VIP to SMT/ES and S/Hybrid'99

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