W.J. Plumbridge
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Journal Articles

Tin pest in lead‐containing solders

W.J. Plumbridge
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (1): 56–57.
https://doi.org/10.1108/09540911011015157
Published: 09 February 2010
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Journal Articles

Implementing lead‐free solders – the performance aspects

W.J. Plumbridge
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (1): 11–18.
https://doi.org/10.1108/09540910610647071
Published: 01 January 2006
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Journal Articles

Long term mechanical reliability with lead‐free solders

W.J. Plumbridge
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2): 13–20.
https://doi.org/10.1108/09540910410537291
Published: 01 August 2004
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Journal Articles

The analysis of creep data for solder alloys

W.J. Plumbridge
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2003) 15 (1): 26–30.
https://doi.org/10.1108/09540910310455699
Published: 01 April 2003
View article titled, The analysis of creep data for solder alloys
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Journal Articles

Lead‐free solders in Japan (a personal impression)

W.J. Plumbridge
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2000) 12 (1): 32–34.
https://doi.org/10.1108/09540910010312410
Published: 01 April 2000
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Journal Articles

Materials behaviour and the reliability in performance of solder joints

W.J. Plumbridge
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1999) 11 (3): 8–11.
https://doi.org/10.1108/09540919910293810
Published: 01 December 1999
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Journal Articles

The Mechanical Behaviour of Solders*

W.J. Plumbridge
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1996) 8 (1): 27–31.
https://doi.org/10.1108/09540919610777582
Published: 01 April 1996
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