The Second International IEEE Symposium on Polymeric Electronics Packaging (PEP'99)

Keywords IEEE, Electronics packaging

24-28 October 1999, Göteborg, SwedenVenue: Hotel Sheraton

Announcement and call for abstracts

Following the successful First International IEEE Symposium on Polymeric Electronics Packaging (PEP'97),Norrköping, Sweden, TeknikCentrum, IVF and IEEE Sweden CPMT Chapter again plan to jointly organize the Second International Symposium in Polymeric Electronics Packaging (PEP'99) in Göteborg, Sweden between 24-28 October 1999. Göteborg is the second largest city and is situated on the west coast of Sweden. The symposium will also be supported by Ericsson, The Chalmers University of Technology, The National Swedish Board for Technical Development(NUTEK) and IEEE CPMT Society, USA and IEEE CPMT Sweden Chapter. Speakers are invited to submit a 300 word abstract, preferably in the following areas:

  • Materials and process development, reliability, modelling, simulation,design, thermal and electrical performance, environmental and life cycle analysis and failure mechanisms in using conductive and non-conductive adhesives, underfilling, glop-top and die-attach materials for microelectronics,opto-electronics and photonics packaging.

  • Plastic encapsulation and underfilling technology and reliability issues,for instance UV-curable glop-top materials and thermoplastic underfilling materials.

  • Polymeric substrate development, for instance micro-via technology.

  • Other novel applications, including insulators, dielectrics, moulding compounds and potting applications.

A 300 word abstract describing the nature, scope, content, organisation and key results of the proposed paper are required. Deadline for the abstract submission is 15 August 1999. Notification of abstracts will be made by 1 September 1999. Paper selection and notification of acceptance of the abstract will be made by15 September 1999 and the final paper is required by 1 October 1999.

Conference exhibition: The exhibition will be focused on the polymeric materials, equipment for polymeric electronics packaging and production. For exhibition details, please contact the conference secretariat.

Conference secretariat:IVF, Laila Palmberg. Fax: +46-31-27 61 30; E-mail: laila.palmberg@ivf.se; Tel: +46-31-706 6000.

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