IPC. IPC to create roadmap for lead-free electronic assemblies

Institute news

IPC

IPC to create roadmap for lead-free electronic assemblies

Keywords IPC, Lead-free soldering,Electronics industry

As Europe decides whether to adopt a resolution to eliminate lead in electronics assemblies by 2004, IPC is taking a lead role in encouraging the development of lead-free electronics assemblies by creating a roadmap to create useful alternatives.

"Work has taken place on lead-free alternatives for many years. Many solutions exist, but cannot work unless another condition is met. For example, solder alloy must be compatible with component finishes", says IPC vice president of standards and technology Dave Bergman. "A roadmap that can get the entire industry marching in the same direction may make possible what some say is impossible."

IPC will hold its first meeting to develop the roadmap at IPCWorks '99, which serves as the IPC Fall Meeting. Bergman says that every facet of the printed wiring board industry has to be involved for the roadmap to be an effective tool, including participants from the supply chain, material suppliers, component manufacturers, PWB manufacturers, electronics manufacturing services (EMS) companies, and OEMs.

Resistance to the creation of a lead-free electronics assembly roadmap is minimal according to Bergman. For those who think the answers are already apparent and it is just a matter of the industry picking a winning alternative, he cautions that the issue is more complex. "My feeling is that the choice will be better for the entire industry if more debate takes place and more companies take a role in making the decision. We invite the industry to join us in Minneapolis to take the first steps in developing this roadmap."