DEK appoints new advanced technologies engineer
DEK appoints new advanced technologies engineer
Keyword DEK
Jeff Schake has been appointed advanced technologies engineer at DEK, enhancing the company's focus on global process development. He will work as part of the Advanced Technologies Group at the Dover Technologies Surface Mount Laboratory in Binghamton, New York, USA.
Schake joins DEK from Universal Instruments, where he spent two and a half years working on research activities associated with the BGA/DCA Consortium, DCA/CSP Consortium and the current Area Array Consortium. The majority of the research was focused on stencil printing wafers. He has three separate degrees from the State University of New York; batchelors degrees in physics and mechanical engineering, and a masters degree in industrial engineering.
Schake has also spent three months at the Cornell Nonofabrication Facility, using various wafer fabrication equipment, and worked at DOVatron International, carrying out a no-clean solder paste evaluation. His current research projects include wafer bumping, BGA/CSP substrate bumping and lead-free solder paste printing/reflow.
