New Speedline MPM software package

New Speedline MPM software package

Keywords Speedline, Software, Stencil printers

For high-speed,high-volume stencil printing, Speedline MPM's Ultraprint 3000, 2000 and AP HiE Series printers claim to have gained greater productivity and advanced process control with the introduction of the new Version 7.0 software package. This latest software, developed at Speedline MPM, is equipped with over 50 new enhanced programming features compared with the previous Version 6.0 software package, and will enable Speedline MPM's stencil printers to reduce cycle and set-up times, and improve inspection capabilities.

Version 7.0 software provides the core technology that enables Speedline MPM's stencil printers to maintain constant and exact control of every critical process. Its carefully integrated programmes work in unison throughout every phase of printing,incorporating features such as a precise vision system, variable print angles,automatic pin placement, and automatic board thickness compensation, to name a few.

Version 7.0 software programme features include:

• Custom BGA: enables users to programme a "custom" BGA or Micro-BGA device with pads as small as 0.254mm (0.010in.), and a maximum I-O array size of up to 2,500 pads and inspect these devices at industry-leading speeds between 0.6-1.0 second per field of inspection.

• Automatic vision offsets: with Version 7.0, process engineers can now quickly and easily programme vision offsets, resulting in accurate offset direction and amounts.

• Low contrast 2D: allows users to effectively programme and inspect devices that are often indistinguishable from the PCB background, including ceramic boards, flex circuits and boards with very light or translucent solder masks.

• Idle time recovery: version 7.0 software programmes a stroke that enables the paste to recover from an "unused" condition by allowing the user to predefine this stroke after a specified amount of down time has elapsed.