AutoLSM semi-automatic solder paste inspection
AutoLSM semi-automatic solder paste inspection
Keywords CyberOptics, Inspection, Solder pastes
CyberOptics Corporation introduces the AutoLSM™ 3D solder paste inspection system with automatic height measurement (Plate 1). With one click on the AutoMeasure™ icon,image analysis software locates the laser stripe and reports paste height. Measurement repeatability using AutoLSM is substantially better than manual systems which require subjective adjustments. Using AutoMeasure, even an inexperienced operator can take precise, repeatable measurements with 0.15mil(3.8 micron) height resolution.
Plate 1 AutoLSM 3D solder paste inspection system
AutoLSM is used off-line for checking wet solder paste on freshly-printed PCBs to confirm printing quality. Collected data include paste height, length, width, area and volume. A circular cursor measures area and volume of round BGA imprints.
The system combines laser-based, non-contact measurement technology with an easy-to-use Windows®98 interface. Priced at under $20,000, AutoLSM is an affordable way to monitor the printing process, reduce defects and improve yields.
Unlike 2D inspection or visual methods, AutoLSM reports 3D measurements including paste volume, the most reliable predictor of finished board quality. Besides inspecting wet solder paste, AutoLSM can be used to check stencil apertures, evaluate mask and plating thickness, examine glue dots and similar applications.
AutoLSM is the successor to CyberOptics' LSM systems, the world's best-selling solder paste inspection tool, in use today at hundreds of SMT board assembly locations around the globe.
For more information,please call 800.746.6315 (+1 (612) 542 5927). www.cyberoptics.com
