SMTA conference at NEPCON East 2000 features 14 in-depth sessions and lead-free symposium
Keywords NEPCON, Conferences
Expanded educational opportunities at NEPCON East 2000, the North-east's leading source for electronics manufacturing solutions, include an SMTA-sponsored conference and two-day symposium on lead-free interconnect technology. The conference and exhibition will take place 12, 13 and 14 June 2000 at the Bayside Exposition Center in Boston, MA.
Featuring four in-depth, day long sessions and ten half day sessions, the SMTA conference will touch on many of the industry's hottest topics, including:
BGA and CSP overview, implementation and reliability;
BGA and CSP rework: theory, methods and applications;
correctly implementing the make-buy decision by understanding true manufacturing costs;
design for SMT manufacturability from an assembly point of view;
IPC-610 comparison clinic;
lead free solders: year 2000 and beyond;
microvia and high density interconnect: material selection, fabrication processes, and design guidelines;
new and emerging technologies for electronic packaging and assembly;
process control in electronics assembly;
reflow soldering and troubleshooting for SMT, BGA, CSP and flip chip processes;
SMT stencil and printing inspection;
solder paste reflow for through hole technology;
troubleshooting the wave soldering process;
troubleshooting the reflow soldering process.
Complete conference information, including registration forms, session descriptions, course schedules and speaker names, may be obtained by visiting www.nepcon.com or www.smta.org.
