Issues

Appointments

Vitronics Soltec names new president, sales director for North and South America

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New addition to Siemens technical sales and marketing team

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GenRad

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Todd Fielitz joins MRSI as West Coast sales manager

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Fraser joins Quad Systems as general manager and director of Quad Europe Limited

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Shoneck named CEO

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Juki Automation Systems management team

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Miller Freeman appoints Mario Fiems as director of Intertronic

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Interconnect Devices, Inc. hires Dave Gast as director of marketing

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Indium extends customer support into Romania

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Quad names Losco vice president operations

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Art Burkhart appointed manager, strategic marketing

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Solder joint reliability of plastic ball grid array with solder bumped flip chip

Shi‐Wei Ricky Lee; John H. Lau
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Wettability test method for surface mount technology assessment

C.C. Tu; M.E. Natishan
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The impact of process parameters on gold elimination from soldered connector assemblies

P.T. Vianco; A.C. Kilgo
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The impact of underfill properties on the thermomechanical reliability of FCOB assembly

Jicun Lu; Jianhua Wu; Yih Pin Liew; Thiam Beng Lim; Xiangfu Zong
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TBGA reliability in telecom environment

Virpi Pennanen; Markku Tammenmaa; Tommi Reinikainen; Jiansen Zhu; Wei Lin
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Viscoplastic Anand model for solder alloys and its application

Z.N. Cheng; G.Z. Wang; L. Chen; J. Wilde; K. Becker
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Conference reports

Organisers and exhibitors claim success for inaugural APEX 2000 show

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1st International Workshop on Electronics Materials and Packaging (EMAP'99)

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Technical programme of the SMT/ES&S/Hybrid Conference

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Editorial

Lead free - will it help our environment?

David Whalley
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Exhibitions and conferences

US Department of Commerce selects NEPCON West 2001 for its international buyer program schedule

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Electro 2000 features free multi-track technical conference developed by IEEE

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SMTA conference at NEPCON East 2000 features 14 in-depth sessions and lead-free symposium

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Industry news

Earth Tronics announces major new investment to fund the growing demand for solder recovery

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Multicore de Mexico - facilities established

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MRSI 175 ENCore encapsulation system captures vision award

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PMJ's Annual General Meeting rejects the planned merger

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Protonique has moved

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Juki Automation Systems expands presence in North America, Europe

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GenRad acquires Nicolet Imaging Systems and Sierra Research and Technology Inc.

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JOT automation group and PMJ automec to merge

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Flextronics International completes acquisition of Palo Alto Products International

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Intelligent Reasoning Systems International expands European infrastructure

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A question of sinking or swimming

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Flextronics completes acquisition of the Dii Group

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GenRad furthers automotive aftermarket initiatives with tender offer for Autodiagnos AB

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GenRad acquires Nicolet Imaging Systems and Sierra Research & Technology, Inc.

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German court favors Quad's patent positions regarding component alignment systems

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Intelligent Reasoning Systems Inc. secures funding for 'aggressive growth'

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Institute news

NPL offer industry assistance with R&D or scientific work

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NPL announce a project for thermal profiling of electronics assembly

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SMTA International 2000 conference program

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IPC

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Pan Pacific conference and exhibition a success

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SMTA announces national conference on lead-free

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AMRC/TMRC keynote to give present knowledge on the future of telecommunications

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AOI benchmarking for new lead-free finishes

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5th annual new and emerging technologies for electronics packaging and assembly

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IPC announces updated releases of GenCAM document and CD

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NPL offers assistance for processing and recycling plastic materials

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NPL announces two collaborative projects with industry

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TISA - New trade association formed

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IPC issues call for papers for IPCWORKS 2000

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International diary

International diary

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New products

AOI system capabilities enhanced by new software

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New conformal coating from ISL is ozone friendly

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BGA reballing preforms now with lead-free spheres

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Speedline Electrovert launches aqueous cleaner

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Enhanced under-board heater from Metcal reduces the risk of board and component damage during BGA rework

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New placement system claims to provide industry's highest productivity rate in component placement

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High speed, 100 percent solder paste inspection

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Alpha launches electroformed stencils

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New stencil printer from Speedline MPM delivers competitive price-performance ratio

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Bulk feeding of 0402 components from Siemens

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Successor to existing reflow soldering methods and lead-free Synergie(TM) launched by Concoat at Nepcon UK

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Genrad introduces TestStation Accelerate

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Surface Mount Techniques introduces new 2220PTV in-line automated printer

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New Quad multi-lane belt feeders increase throughput and pickup efficiency

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Highly versatile screen printer

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AAT launches revolutionary Hydrojet in-line cleaning system

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Teradyne introduces the Optima 7300 Post-Reflow Automated Optical Inspection System

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Techspray(TM) introduces new conformal coating remover pen

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Intertronics announces new range of video magnifiers

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Automation Unlimited 'closes the loop' in automated robotic soldering process control

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MRSI intros advanced technology for eutectic die attach

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Epoxy free fiducials improve stencil performance

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Loctite launches the first commercially available reworkable underfill

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Juki Automation Systems introduces the 2000 Series placement machines

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New DRS20 provides total control

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Heraeus speeds production with new SMD adhesive

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GENRAD announces general purpose CAD data preparation software

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Autosplice offers new CNC direct drive retrofit kit

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Rugged high speed paste from Heraeus

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New Quad bulk feeders enhance placement system flexibility, accuracy and utilization

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Temperature profiling just got easier

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SMART news

The SMART Group announce SMART Fellow Awards

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SMART launch DTI lead-free update

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The SMART group lead-free seminar attracts over 200 delegates

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