Siplace S and Siplace F introduce placement head modularity
Siplace S and Siplace F introduce placement head modularity
Keywords Siplace, Placement
The Production and Logistics Systems Group (PL) has added another feature to the flexibility of the S and F Siplace placement systems. The placement machines can now be equipped with either six-segment or 12-segment Collect&Place revolver heads (C&P) depending upon the requirement profile (Plate 3). The expansion of the Sip/ace system "Modular manufacturing" concept now enables optimum machine configuration, matched to the product to be manufactured. The perfect clocking of the entire placement line leads to the highest placement rate and to optimum utilisation of the machines, and thus of the investment. This expansion of Sip/ace technology is of benefit to all customers – both retrofitters and new buyers equally well whether in high-volume production, such as the computer industry or telecom-munications, or in the low-volume/high-mix field, such as in the automotive industry. This will even increase the capabilities of contract manufacturers supplying these target groups. The Siplace F series is a placement system with one gantry on which two placement heads work – one Pick&Place head (P&P) and one Collect&Place revolver head. From today, not only a six segment C&P head but also a 12 segment C&P head can be used with the Sip/ace F HM (head modularity). The Siplace S series is a system with two gantries, on each of which one placement head works. Previously, the Siplace S was exclusively equipped with two 12 segment C&P heads. Now any combination of six and 12 segment C&P revolver heads can be used on the future Siplace S HM.
Plate 3Six or 12 segment Collect&Place revolver heads can now equip S and F Siplace placement systems
The 12 segment revolver head works accurate and fast for all standard SMT components including 0201 chips, SOT (small outline transistor) and BGA up to 18.7 x 18.7mm. The components are picked up and placed gently and securely with the aid of vacuum and blast air. A camera on the revolver head determines the exact position of each component on the nozzle. Deviations are corrected before placement takes place and these are then taken into consideration in subsequent component pickups. Even the component package form is checked against the programmed values, and the component is not placed if tolerances are exceeded. Automatic reworking takes place in a repair run. The 12 segment revolver head achieves a maximum placement rate of 12,500 components/hour with a maximum accuracy of +/-90 µm at four sigma. The six segment revolver head is used for all advanced components up to 32 x 32 mm (chips, QFP, BGA, etc.). It is therefore recommended for use when substantial numbers of ICs have to be placed on the PCBs. This leads to a substantial increase in performance, particularly in the main application range from PLCC 44 up to QFP 208. The placement accuracy is +/- 70µm at four sigma. The maximum rate is 8,500 components/hour.
The DCA (direct chip attach) model of the 6 segment head is designed for the fastest placement combined with even greater accuracy for components such as flip-chip and µBGA up to 13 x 13mm. The use of the DCA package has improved placement accuracy to +/-60 µm at four sigma.
The Pick&Place head is used on Siplace machines for all critical or particularly large components, and for non-standard package forms. It achieves outstanding accuracy of +/-50µm, four sigma, or even +/-40µm, four sigma with a special camera.
