Issues

Pb free – time to prepare

Appointments

Fischthal joins Quad Systems as product manager

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Organisational changes at PMJ

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Orbotech appoints European marketing manager for electronics assembly division

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Quad names Perrotta vice president, technical services and support

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Association news

SMTA awards announced

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IPC announces dates for Autumn AMRC/TMRC meetings

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New IPC standard ends confusion for defect opportunities in benchmarking

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On the degradation of the solder joints of underfilled flip chip packages: a case study

Zhang Qun; Xie Xiaoming; Chen Liu; Wang Guozhong; Cheng Zhaonian; Wolfgang Kempe
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Stencil design for mixed technology through‐hole/SMT placement and reflow

William E. Coleman; Denis Jean; Julie R. Bradbury‐Bennett
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Rework of CSP: the effect on surface intermetallic growth

T.A. Nguty; N.N. Ekere; J.D. Philpott; G.D. Jones
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Development and validation of lead‐free wave soldering process

Atso Forstén; Hector Steen; Ian Wilding; Jürgen Friedrich
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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

Qinong Zhu; Mei Sheng; Le Luo
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A study of solder paste printing requirements for CSP technology

Jeff Kennedy
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Exhibitions and conferences

SMT/ES&S/2000 Hybrid final report

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WESCON Spring 2001 and new EtroniX event co-locate to provide solutions across the supply chain

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Keynote speaker Dr Robert Ballard to focus on success at APEX 2001

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Assembly and reliability of lead-free solders headline APEX conference

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APEX exhibit floor sells out

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Productronica 1999: results of the exhibitor and visitor survey

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SMT/ES&S/Hybrid 2001

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Guest editorial

Pb free – time to prepare

Kay Nimmo
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Industry news

PAF-Dessouter application story

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Dross Recovery System

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European study casts doubts on current SIR testing

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Wally Rubin receives prestigious IPC award

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Tecnomatix and Orbotech announce cooperation on new quality management software solution

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DEK consolidates in Central Europe

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Humiseal to be manufactured in Europe by Concoat

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GenRad announces completion of autodiagnos AB acquisition

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AIM and Crossflow International form collaborative venture

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PMJ acquires Greenhill Oy

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Flextronics international announces two-for-one stock split

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www.whichcompany.net Launch

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ATF appoint Leed Automation exclusively in UK

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NPL seek cleaning project equipment partners for new project

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Metcal signs up Nisus

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Leica Microsystems plans initial public offering

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MV Technology announces new manufacturing facilities

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NPL meeting keeps the industry informed

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Two electronics industry marketing firms announce strategic partnership

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Mydata announces new agent for Scotland

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Loctite to acquire Dexter speciality Polymers business

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GenRad reorganises worldwide

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Valor and Orbotech to develop reference data interface

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Saunders Technology announces acquisition by ECD

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Philips EMT's

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Specifying entire lines stress-free

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Strong support for Eastern Europe

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Flextronics international and Chatham Technologies sign definitive merger agreement

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International diary

International diary

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Internet commentary

Belief in progress is a doctrine of the lazy

Brian Ellis
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New products

ECD's Profile Planner(TM) programme provides robust profile generation solution

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Revolutionary PDM suite bridges CAD-MRP domains, delivering first comprehensive solution to product life-cycle management

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Versatile new soldering and desoldering machines from Zevac

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Mydata introduces MYLabel for increased component traceability

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PMJ launches HiSAC 1502 final assembly cell

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New OSP-1 advanced programmable clinch option for odd-form placement

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Orbotech introduces new AOI series for electronics assembly manufacturing

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Faster electrical potting and sealing with new light curing adhesives

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Tip for tight testing

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Multicore solders introduces new lead-free no-clean solder paste for SMT assembly

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New high speed surface mount adhesive for difficult to bond applications

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Heraeus PD966 high speed adhesive

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Combined AOI/AXI inspection system recognises both visible and hidden faults on circuit boards

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Printer with automatic vision alignment

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Techspray(TM) introduces new ESD-safe packaging for desoldering braid

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Mydata releases CAD Conversion 4.0 for easier conversion

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Lackwerke Peters introduce variable cure conformal coating

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Vitronics Soltec integrates ECD AutoM.O.L.E. technology into wave and reflow soldering systems

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Alpha launch new paste on the Web

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LeadScan sensing system makes PMJ's odd-form assembly cells even better

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No need to place wrong parts ever again?

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Juki takes component placement into the 21st century

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Siplace S and Siplace F introduce placement head modularity

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New HSP knowledge base now available on line

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User-friendly AOI system for pre-reflow inspection

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New Loctite adhesive in Pro Flow cartridge eliminates waste

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Vitronics Soltec's Flux Management(TM) ensures clean, efficient reflow processing

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Concoat develops unique water-based Humiseal coating

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Publications

SIR testing and the performance of conformal settings

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TFI releases forecasts for M&A activity through 2001 and beyond

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Q1 year 2000: top 40 European CEM ranking

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Metcal CD-ROM for BGA rework and repair know-how

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Lead-free visual inspection guidelines available

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Seminars, workshops and tutorials

Seminars, workshops and tutorials

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SMART news

Brighton 2000: opportunities and challenges into the future for electronics manufacturing

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Brighton 2000 The SMART Group European Surface Mount Conference

Mike Judd
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Conformal coating workshop, 6 June 2000

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The SMART Group Annual General Meeting

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Workshops and training courses

Adhesives in electronics network launch education offensive

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