AIM and Crossflow International form collaborative venture
AIM and Crossflow International form collaborative venture
Keywords AIM, Crossflow, Solder paste
AIM has entered into collaboration with Crossflow International, a leading provider of solder paste printing accessories. Per the collaboration, AIM will perform extensive testing with the Paste Puck at their US Technical Applications Laboratory. The Paste Puck, introduced by Crossflow International earlier this year, is an enclosed mechanical paste deposition unit designed to increase the consistency of the paste printing operation. By performing this testing, AIM intends to bolster its understanding of the Paste Puck and enclosed print heads in general.
The Paste Puck is an enclosed print head that deposits solder paste on a stencil via mechanical force. The Paste Puck has the advantage of requiring very low pressure in order to deposit the solder paste, which results in a decrease of print head related defects such as paste separation and compaction. In addition, the Paste Puck offers the advantage of being adaptable to nearly all models of printing equipment currently in use without the addition of an outside power source or software revision. As with other print head units, the Paste Puck offers benefits such as isolating the solder paste from negative environmental effects, reducing paste waste, prolonging the workable life of the paste, and improving the consistency of print deposits.
