Heraeus introduces top performing F10 no-clean solder paste

Heraeus introduces top performing F10 no-clean solder paste

Keyword: Solder paste

Heraeus Inc., Circuit Materials Division has announced the introduction of F10, a high-performance no-clean L0 solder paste with exceptional solderability and printability. F10 has been shown to produce significant reductions in defect rates and to improve process yields in comparison with other no-clean solder pastes.

Beta testing has demonstrated higher first-pass yields using F10 in production conditions than can be achieved with other no-clean solder pastes. Independent laboratory testing has qualified F10 as an L0 no-clean solder paste.

Heraeus's new F10 provides unparalleled air reflow wetting on difficult surface finishes. A proprietary blend of high-performance activators enables the paste to produce complete fine-pitch pad coverage with as little as 50 percent pad coverage on leading OSP board finishes. F10 eliminates hot slump, which can lead to solder defects, to achieve high first-pass yields.

For further information visit the Web site: www.4cmd.com