AIM acquires SMT solder paste assets of OMG’s microbond division

AIM acquires SMT solder paste assets of OMG’s microbond division

Keywords: Solder paste

AIM has announced the acquisition of the SMT solder paste assets of OMG’s Microbond division. The assets include all SMT solder paste manufacturing equipment and intellectual property from OMG’s Research Triangle Park(RTP) facility in Raleigh, North Carolina, USA.

The Microbond SMT line includes no-clean, water soluble and RMA solder pastes produced in a variety of solder alloys, including lead-free alloys. These products allow broad process latitudes and robust print and reflow profiles,enabling them to accommodate a wide variety of SMT applications.

Microbond SMT solder pastes will continue to be available without disruption from AIM. AIM will manufacture Microbond SMT solder pastes utilizing the same equipment, raw materials, procedures and quality standards, ensuring a seamless transition for current OMG customers. Customers will benefit from increased product availability, enabling the purchase of Microbond SMT solder pastes directly from AIM or through AIM’s global sales network.