Issues

Appointments

Texcel Technology appoints John Bergin

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Association news

SOLDERTEC announces winners of lead-free solder awards 2002

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Sixty six members honored at 2002 IPC annual meeting

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SMTA annual awards announced

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2003 SMTA Pan Pacific Symposium Exhibit and sponsorship opportunities

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Book reviews

Six Sigma for Electronics Design and Manufacturing

Bob Willis
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Protecting the Ozone Layer

Brian Ellis
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Environmental-Friendly Electronics: Lead-Free Technology

Bob Willis
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Fundamentals of Microsystems Packaging

Bob Willis
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Green Electronics/Green Bottom Line

Bob Willis
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Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies

Bob Willis
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Reducing bonding cycle time of adhesive flip chip process

Anne Seppälä; Kati Aalto; Eero Ristolainen
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Creep behaviour of composite lead‐free electronic solder joints

F. Guo; J. Lee; K.N. Subramanian
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The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs

S.T. Nurmi; J.J. Sundelin; E.O. Ristolainen; T. Lepistö
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The analysis of creep data for solder alloys

W.J. Plumbridge
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Advanced alloy for lead‐free solder balls

Marc Dittes; Hermann Walter
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Fine pitch stencil printing using enclosed printing systems

Ling Chunxian Zou; Milos Dusek; Martin Wickham; Christopher Hunt
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Finite element analysis of a three‐dimensional package

Zhaowei Zhong; Peng Kiong Yip
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Contact resistance of metal‐coated polymer particles used in anisotropically conductive adhesives

Jarmo Määttänen
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Editorial

Maintaining confidence in research

Peter Grundy
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Industry news

Business co-operation between Nihon Superior and DKL Metals Ltd

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KIC opens first European office

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Tin Technology leads project on halogen-free, flame retardant systems

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EKRA and FUJI machine manufacturing announce OEM agreement

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July 2006: Europe agrees lead ban in electrical and electronic equipment

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Norgren launches new grippers for electronics production market

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Nigel Griffiths launches new Asia Pacific electronics business association

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AIM acquires SMT solder paste assets of OMG’s microbond division

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New European headquarters in Krefeld

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International diary

International diary

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Internet commentary

Internet commentary

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New products

248 now available online

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New: Collimator add-on for X-ray tubes

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Asymtek releases Fluidmove® for Windows NT® Version 4.5

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AIM announces Sn63LT alloy for reducing tombstoning

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Cobar debuts “Solder-Ball Killer” wave soldering flux

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Automatic printer for small batches

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Pin-in-hole reflow specialist proves fit-for-purpose stencils

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Note from the publisher

Note from the publisher

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Publications

Derwent launches BioMEMs, Lab-on-a-Chip Industry and Technology Patents Profile

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Peak booklet spells out common test mistakes

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SMART Group news

Obituary – Alan Jones

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Despite a sad cloud over Brighton, the 5th European Conference was successful

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