K.N. Subramanian
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Journal Articles

Effect of strain on whisker growth in matte tin

A.R. Southworth, C.E. Ho, A. Lee, K.N. Subramanian
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (1): 4–7.
https://doi.org/10.1108/09540910810861422
Published: 08 February 2008
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Journal Articles

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre‐strained eutectic Sn‐3.5Ag solder joints

H. Rhee, K.N. Subramanian
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2006) 18 (1): 19–28.
https://doi.org/10.1108/09540910610647080
Published: 01 January 2006
View article titled, Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre‐strained eutectic Sn‐3.5Ag solder joints
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Journal Articles

Microstructural features contributing to enhanced behaviour of Sn‐Ag based solder joints

J.G. Lee, K.N. Subramanian
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (1): 33–39.
https://doi.org/10.1108/09540910510579221
Published: 01 March 2005
View article titled, Microstructural features contributing to enhanced behaviour of Sn‐Ag based solder joints
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Journal Articles

Mechanical characterization of Sn‐3.5Ag solder joints at various temperatures

H. Rhee, K.N. Subramanian, A. Lee, J.G. Lee
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2003) 15 (3): 21–26.
https://doi.org/10.1108/09540910310505080
Published: 01 December 2003
View article titled, Mechanical characterization of Sn‐3.5Ag solder joints at various temperatures
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Journal Articles

Creep behaviour of composite lead‐free electronic solder joints

F. Guo, J. Lee, K.N. Subramanian
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2003) 15 (1): 39–42.
https://doi.org/10.1108/09540910310455716
Published: 01 April 2003
View article titled, Creep behaviour of composite lead‐free electronic solder joints
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Journal Articles

Intermetallic morphology around Ni particles in Sn‐3.5Ag solder

J.G. Lee, F. Guo, K.N. Subramanian, J.P. Lucas
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (2): 11–17.
https://doi.org/10.1108/09540910210427772
Published: 01 August 2002
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Journal Articles

Effects of Pb contamination on the eutectic Sn‐Ag solder joint

S. Choi, T.R. Bieler, K.N. Subramanian, J.P. Lucas
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (2): 26–29.
https://doi.org/10.1108/09540910110385220
Published: 01 August 2001
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Journal Articles

Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders

F. Guo, S. Choi, J.P. Lucas, K.N. Subramanian
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (1): 7–18.
https://doi.org/10.1108/09540910110361668
Published: 01 April 2001
View article titled, Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders
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