Skip to Main Content
F. Guo
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Creep behaviour of composite lead‐free electronic solder joints

Available to Purchase
F. Guo, J. Lee, K.N. Subramanian
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2003) 15 (1): 39–42.
https://doi.org/10.1108/09540910310455716
Published: 01 April 2003
View article titled, Creep behaviour of composite lead‐free electronic solder joints
Open the PDF for Creep behaviour of composite lead‐free electronic solder joints in another window
Add to Citation Manager for Creep behaviour of composite lead‐free electronic solder joints
Journal Articles

Intermetallic morphology around Ni particles in Sn‐3.5Ag solder

Available to Purchase
J.G. Lee, F. Guo, K.N. Subramanian, J.P. Lucas
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (2): 11–17.
https://doi.org/10.1108/09540910210427772
Published: 01 August 2002
View article titled, Intermetallic morphology around Ni particles in Sn‐3.5Ag solder
Open the PDF for Intermetallic morphology around Ni particles in Sn‐3.5Ag solder in another window
Add to Citation Manager for Intermetallic morphology around Ni particles in Sn‐3.5Ag solder
Journal Articles

Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders

Available to Purchase
F. Guo, S. Choi, J.P. Lucas, K.N. Subramanian
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (1): 7–18.
https://doi.org/10.1108/09540910110361668
Published: 01 April 2001
View article titled, Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders
Open the PDF for Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders in another window
Add to Citation Manager for Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal