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Journal Articles

Effects of Pb contamination on the eutectic Sn‐Ag solder joint

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S. Choi, T.R. Bieler, K.N. Subramanian, J.P. Lucas
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (2): 26–29.
https://doi.org/10.1108/09540910110385220
Published: 01 August 2001
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Journal Articles

Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders

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F. Guo, S. Choi, J.P. Lucas, K.N. Subramanian
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (1): 7–18.
https://doi.org/10.1108/09540910110361668
Published: 01 April 2001
View article titled, Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders
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