Lead‐free soldering is becoming a common practice in the electronics industry because of the growing general opposition to lead‐containing solders. The reliability of lead‐free solders has been studied a lot recently, but knowledge of it is still incomplete and many issues related to them are under heavy debate. This paper presents results from a study of the formation of voids with regard to the number of reflow cycles in three different kinds of solder joints: first the ones prepared with lead‐free solder paste and lead‐free plastic ball grid array (PBGA) components, next the ones prepared with lead‐free solder paste and tin‐lead‐silver PBGA components, and last the ones prepared with tin‐lead solder paste and tin‐lead‐silver PBGA components.
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1 April 2003
Research Article|
April 01 2003
The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs
S.T. Nurmi;
S.T. Nurmi
Tampere University of Technology, Finland
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J.J. Sundelin;
J.J. Sundelin
Tampere University of Technology, Finland
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E.O. Ristolainen;
E.O. Ristolainen
Tampere University of Technology, Finland
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T. Lepistö
T. Lepistö
Tampere University of Technology, Finland
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Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
2003
Soldering & Surface Mount Technology (2003) 15 (1): 31–38.
Citation
Nurmi S, Sundelin J, Ristolainen E, Lepistö T (2003), "The influence of multiple reflow cycles on solder joint voids for lead‐free PBGAs". Soldering & Surface Mount Technology, Vol. 15 No. 1 pp. 31–38, doi: https://doi.org/10.1108/09540910310455707
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