Finite element analysis of a three‐dimensional package

A three‐dimensional (3D) package consisting of a stack of three silicon chips was conceptually designed. A finite element simulation of this 3D package was conducted in order to compare the fatigue lives of the solder joints with those in a typical single flip chip package when subjected to a cyclic thermal loading. It was found that the proposed design of the 3D package was feasible in terms of its mechanical deformation response to the thermal cycle.