N.N. Ekere
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Journal Articles

Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead‐free solder pastes

A.E. Marks, N.N. Ekere, S. Mallik, R. Bhatti
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (2): 75–84.
https://doi.org/10.1108/09540911111120140
Published: 12 April 2011
View article titled, Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead‐free solder pastes
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Journal Articles

Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

S. Mallik, M. Schmidt, R. Bauer, N.N. Ekere
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (4): 42–49.
https://doi.org/10.1108/09540911011076871
Published: 21 September 2010
View article titled, Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance
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Journal Articles

Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma‐treated HASL finish PCBs

G. Takyi, N.N. Ekere
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (3): 17–21.
https://doi.org/10.1108/09540911011054154
Published: 29 June 2010
View article titled, Investigation of the effect of nitrogen and air atmospheres on solder wettability of plasma‐treated HASL finish PCBs
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Journal Articles

Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering

G. Takyi, N.N. Ekere
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (2): 37–42.
https://doi.org/10.1108/09540911011036271
Published: 13 April 2010
View article titled, Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering
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Journal Articles

Solder paste characterisation: towards the development of quality control (QC) tool

R. Durairaj, S. Mallik, N.N. Ekere
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (3): 34–40.
https://doi.org/10.1108/09540910810885705
Published: 27 June 2008
View article titled, Solder paste characterisation: towards the development of quality control (QC) tool
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Journal Articles

An investigation into the rheological properties of different lead‐free solder pastes for surface mount applications

S. Mallik, N.N. Ekere, R. Durairaj, A.E. Marks
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 3–10.
https://doi.org/10.1108/09540910810871511
Published: 11 April 2008
View article titled, An investigation into the rheological properties of different lead‐free solder pastes for surface mount applications
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Journal Articles

Correlation between jamming and skipping during solder paste printing

S.R. Hillman, S.H. Mannan, R. Durairaj, A. Seman, N.N. Ekere, M. Dusek, C. Hunt
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (4): 17–26.
https://doi.org/10.1108/09540910510630395
Published: 01 December 2005
View article titled, Correlation between jamming and skipping during solder paste printing
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Journal Articles

Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications

G.J. Jackson, M.W. Hendriksen, R.W. Kay, M. Desmulliez, R.K. Durairaj, N.N. Ekere
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (1): 24–32.
https://doi.org/10.1108/09540910510579212
Published: 01 March 2005
View article titled, Sub process challenges in ultra fine pitch stencil printing of type‐6 and type‐7 Pb‐free solder pastes for flip chip assembly applications
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Journal Articles

Reflow profile study of the Sn‐Ag‐Cu solder

B. Salam, C. Virseda, H. Da, N.N. Ekere, R. Durairaj
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 27–34.
https://doi.org/10.1108/09540910410517022
Published: 01 April 2004
View article titled, Reflow profile study of the Sn‐Ag‐Cu solder
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Journal Articles

Correlation of solder paste rheology with computational simulations of the stencil printing process

R. Durairaj, G.J. Jackson, N.N. Ekere, G. Glinski, C. Bailey
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (1): 11–17.
https://doi.org/10.1108/09540910210416422
Published: 01 April 2002
View article titled, Correlation of solder paste rheology with computational simulations of the stencil printing process
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Journal Articles

Critical factors affecting paste flow during the stencil printing of solder paste

R. Durairaj, T.A. Nguty, N.N. Ekere
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2001) 13 (2): 30–34.
https://doi.org/10.1108/09540910110385239
Published: 01 August 2001
View article titled, Critical factors affecting paste flow during the stencil printing of solder paste
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Journal Articles

Rework of CSP: the effect on surface intermetallic growth

T.A. Nguty, N.N. Ekere, J.D. Philpott, G.D. Jones
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2000) 12 (3): 35–38.
https://doi.org/10.1108/09540910010347881
Published: 01 December 2000
View article titled, Rework of CSP: the effect on surface intermetallic growth
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Journal Articles

Cell Controller Software Modelling for PCBA Rework Cell

C.Y. Chan, A.H. Redford, N.N. Ekere
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1994) 6 (3): 46–49.
https://doi.org/10.1108/eb037878
Published: 01 March 1994
View article titled, Cell Controller Software Modelling for PCBA Rework Cell
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Journal Articles

Process Modelling Maps for Solder Paste Printing

N.N. Ekere, E.K. Lo, S.H. Mannan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1994) 6 (2): 4–11.
https://doi.org/10.1108/eb037861
Published: 01 February 1994
View article titled, Process Modelling Maps for Solder Paste Printing
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Journal Articles

Solder Paste Dispensing in Robotic SMD Rework

N. Geren, N.N. Ekere
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1994) 6 (1): 21–25.
https://doi.org/10.1108/eb037851
Published: 01 January 1994
View article titled, Solder Paste Dispensing in Robotic SMD Rework
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Journal Articles

Predicting Scooping and Skipping in Solder Paste Printing for Reflow Soldering of SMT Devices

S.H. Mannan, N.N. Ekere, E.K. Lo, I. Ismail
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1993) 5 (3): 14–17.
https://doi.org/10.1108/eb037835
Published: 01 March 1993
View article titled, Predicting Scooping and Skipping in Solder Paste Printing for Reflow Soldering of SMT Devices
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Journal Articles

The Future of Solder Paste Printing for SMT Reflow Soldering

E.K. Lo, N.N. Ekere, S.H. Mannan, I. Ismail
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (1993) 5 (1): 22–32.
https://doi.org/10.1108/eb037811
Published: 01 January 1993
View article titled, The Future of Solder Paste Printing for SMT Reflow Soldering
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