Multicore solders introduces new lead-free no-clean solder paste for SMT assembly

Multicore solders introduces new lead-free no-clean solder paste for SMT assembly

Keywords Multicore, Loctite, Solder paste, Lead free

Multicore Solders, Inc., a division of Loctite Corporation, has introduced new Multicore CR39, a high reliability lead-free no-clean solder paste designed to solder numerous metal finishes without requiring nitrogen during reflow(Plate 9). Multicore CR39 leaves a minimal, clear, pale residue after reflow using a wide thermal profile. This lead-free product meets the Bellcore and IPC standards for high reliability, no-clean pastes, and is ideal for rapid printing and refIow in air. Multicore CR39 offers excellent open time and tack life,greatly extended abandon times, excellent slump resistance, and good soldering activity over a wide range of refIow profile types. CR39 is suitable for fine pitch, high-speed stencil printing at rates up to 150 mm/second. The product is formulated to solder a variety of surfaces including OSP copper, HASL, gold over nickel, and silver immersion. Multicore CR39 contains a high activity, no-clean flux suitable for most assembly processes. It is especially suited to meet the demands of high volume production processes using components and boards that have less than the desired level of solderability.

 Plate 9Multicore CR39

Further information: http://www.multicore.com