IPC. SSTC Spring Conference & Exhibition
Keywords: Conference, SSTC
Implementing Lead Free Soldering Date: 30 May 2002Venue:National Physical Laboratory (NPL)
This event returns to NPL from Kempton Park as the new conference facilities are now available. The conference focuses on the latest information on the current performance and process issues of lead free soldering, drawing on work from NPL and industry. Presentations will include:
Lead free – what are the real process constraints?Sue Knight,Dave West, Global Solutions Technology, Sanmina – SCI
The effect of PCB finish on lead free reliabilityMilos Dusek, NPL
Lead free soldering at SolectronSteve Harris, Solectron
The effect of mixing lead free alloy in a rework scenarioChris Hunt,NPL
An assessment of the published reliability data for lead free solder jointsMalcolm Warwick, Hector Steen, Loctite Multicore
Predicting microstructure of mixed solder alloy systemsJaspal Nottay,NPL
Materials data in the literatureMartin Wickham, NPL
Effects of lead free reflow on vulnerable componentsAlan Brewin, NPL
PCB performance at the increased temperatures with lead free reflowMartin Wickham, NPL
A table top exhibition will be held during the day. All enquiries to Ling Zou. Tel: +44 (0)202 8943 6583.
