Issues

Association news

SMART group. Design for reliability success

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IPC. New IPC council formed

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SMTA. SMTA international conference sneak preview

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IPC. IPC names new director of communications

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SMTA. Boston to feature three leading edge events

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IPC. SSTC and SMART Group Meeting

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IPC. SSTC Spring Conference & Exhibition

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Intermetallic morphology around Ni particles in Sn‐3.5Ag solder

J.G. Lee; F. Guo; K.N. Subramanian; J.P. Lucas
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Reliability of tin‐lead balled BGAs soldered with lead‐free solder paste

Sami Tapani Nurmi; Eero Olavi Ristolainen
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Solder ball failure mechanisms in plastic ball grid array packages

C.H. Zhong; S. Yi; D.C. Whalley
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Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Minna Arra; Dongkai Shangguan; Eero Ristolainen; Toivo Lepistö
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Degradation of flip‐chip‐on‐glass interconnection with ACF under high humidity and thermal aging

C.M. Lawrence Wu; M.L. Chau
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A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects

P.T. Vianco; J.A. Rejent
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Industry news

Vitronics Soltec appoints Prodelec in Italy

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Flextronics Chief Marketing Officer to speak at NEPCON East

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New process-proven lead-free solution

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Europlacer host lean manufacturing conference

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Valor joins forces with Aster

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1st European Union/United States Lead-Free Solder Interface Meeting

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Cookson consolidates its electronics divisions

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International diary

International diary

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Internet commentary

Internet commentary

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New products

Insight ™ software for reflow tracker

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Void free soldering – inline reflow and vacuum furnace

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New OptiCon software version 3.7 available

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New autofeeder from Autosplice

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Micro-Placer for BGA, QFP and Flip Chip

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Stencil cleaning frame optimises efficiency

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Viscom's 4M camera module increases test speed and passage height

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Reports

Earth Technologies Forum, 2002

Brian Ellis
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