Micro-Placer for BGA, QFP and Flip Chip
Keywords: Assembly, PCB
The new manual pick and place system MPL3100 from ESSEMTEC can accurately place today's state of the art component types. It enhances assembly lines with no capability of placing such components, as well as prototyping or low volume production sites.
Despite manual, the placement process is efficient and very precise possible. An integrated vision system provides an image of the component bottom side as well as of the PCB surface. A two colour, adjustable illumination allows to achieve the best possible contrast for any surface type. For large components an additional split vision system can be inserted which presents the two opposite corners highly enlarged on the monitor. The integrated motorized zoom camera enables to zoom and focus every component sizes by using an external keyboard. The operator aligns now simply the two overlayed images on the monitor by use of the integrated precision micrometer x/y-table. Due to the two colour lights the exact pad to lead matchings is additionally made easier.
The vision box slides on high precision bearings back into the device and allows now to lower the component motorised onto the board.
The high precision mechanic is based on the know how of automatic SMD placement machines which are available from the same manufacturer. It allows to mount precisely all difficult component types in a very efficient way.
The system is available as a stand alone system or integrated in a EXPERT-LINE manual or semiautomatic pick and place system. Existing customers of one of these types of placement system can even upgrade it with a Micro-Placer directly in their location without any service engineer needed.
