New process-proven lead-free solution
Keywords: Lead-free soldering, Assembly
Indium Corporation of America has announced an optimized, lead-free assembly solution for electronics manufacturers. The program, known as QuickStart,was the result of more than two years of collaborative research and development between Indium Corporation and Motorola in the lead-free circuit board assembly process.
QuickStart, which has proven itself in the fielding of more than 100,000 Motorola mobile phones to date, was fuelled by market demand for a viable lead-free assembly process for the electronics industry. Indium Corporation is now positioned to transfer this lead-free assembly solution knowledge across the electronics manufacturing industry. This advanced solution will allow customers a quicker and more cost effective implementation method based on Motorola's in-depth research and quantitative analysis.
The solution was designed to provide a comprehensive analysis of the demanding lead-free manufacturing process including: alloy selection, solder paste screen printing evaluation, reflow process development, tackiness measurements, solder joint reliability evaluation, product electrical and mechanical evaluation, environmental testing, flux vehicle technology, aging experiments, testing catastrophic mechanical failure, metallurgical analysis of the interconnects following exposure to elevated temperature and mechanical stress, and statistical analysis of test results.
