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Journal Articles

A study of SMT assembly processes for fine pitch CSP packages

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Minna Arra, David Geiger, Dongkai Shangguan, Jonas Sjöberg
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (3): 16–21.
https://doi.org/10.1108/09540910410562482
Published: 01 December 2004
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Journal Articles

Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings

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Minna Arra, Todd Castello, Dongkai Shangguan, Eero Ristolainen
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 35–43.
https://doi.org/10.1108/09540910410517031
Published: 01 April 2004
View article titled, Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings
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Journal Articles

Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

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Minna Arra, Dongkai Shangguan, Eero Ristolainen, Toivo Lepistö
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2002) 14 (2): 18–25.
https://doi.org/10.1108/09540910210427781
Published: 01 August 2002
View article titled, Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards
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