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Volume 34, Issue 1
3 January 2022
Soldering & Surface Mount Technology Cover Image for Volume 34, Issue 1
Research Article| July 22 2021

Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies Available to Purchase

Leonid Anatolevich Olenev;
Leonid Anatolevich Olenev
Plekhanov Russian Academy of Economics, Moskva,
Russian Federation
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Rafina Rafkatovna Zakieva;
Rafina Rafkatovna Zakieva
Kazan State Power Engineering University
, Kazan,
Russian Federation
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Nina Nikolaevna Smirnova;
Nina Nikolaevna Smirnova
Saint Petersburg Mining University
, Sankt-Peterburg,
Russian Federation
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Rustem Adamovich Shichiyakh;
Rustem Adamovich Shichiyakh
Kuban State Agrarian University
, Krasnodar,
Russian Federation
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Kirill Aleksandrovich Ershov;
Kirill Aleksandrovich Ershov
I.M. Sechenov First Moscow State Medical University
, Moskva,
Russian Federation
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Nisith Geetha
Nisith Geetha
Department of Electrical and Electronics Engineering, Sengunthar Engineering College, Tiruchengode,
India
Nisith Geetha can be contacted at: nisith.geetha@gmail.com
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Author & Article Information
Nisith Geetha can be contacted at: nisith.geetha@gmail.com
Publisher: Emerald Publishing
Received: December 10 2020
Revision Received: March 13 2021
Accepted: March 19 2021
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© Emerald Publishing Limited
2021
Emerald Publishing Limited
Licensed re-use rights only
Soldering & Surface Mount Technology (2022) 34 (1): 8–15.
https://doi.org/10.1108/SSMT-12-2020-0055
Article history
Received:
December 10 2020
Revision Received:
March 13 2021
Accepted:
March 19 2021
Purpose

This study aims to present a more accurate lifetime prediction model considering solder chemical composition.

Design/methodology/approach

Thermal cycling and standard creep tests as well as finite element simulation were used.

Findings

The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.

Originality/value

It is confirmed.

Keywords:
Sn–Ag–Cu, Solder alloys, Electronic assembly, Thermo-mechanical fatigue, Solder joint
© Emerald Publishing Limited
2021
Emerald Publishing Limited
Licensed re-use rights only
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