Issues

Electronic component detection based on image sample generation

Hao Wu; Quanquan Lv; Jiankang Yang; Xiaodong Yan; Xiangrong Xu
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Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

Leonid Anatolevich Olenev; Rafina Rafkatovna Zakieva; Nina Nikolaevna Smirnova; Rustem Adamovich Shichiyakh; Kirill Aleksandrovich Ershov; Nisith Geetha
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Experimental measurements of the shear force on surface mount components simulating the wave soldering process

Violeta Carvalho; Bruno Arcipreste; Delfim Soares; Luís Ribas; Nelson Rodrigues; Senhorinha Teixeira; José C. Teixeira
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Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

Rafael Kakitani; Cassio Augusto Pinto da Silva; Bismarck Silva; Amauri Garcia; Noé Cheung; José Eduardo Spinelli
View articletitled, Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys
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Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints

Mardiana Said; Muhammad Firdaus Mohd Nazeri; Nurulakmal Mohd Sharif; Ahmad Azmin Mohamad
View articletitled, Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints
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Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model

Yutian Yin; Hongda Zhou; Cai Chen; Yi Zheng; Hongqiao Shen; Yubing Gong
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Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads

Supriyono; Tzu-Chia Chen; Lis M. Yapanto; Zagir Azgarovich Latipov; Angelina Olegovna Zekiy; Lyubov A. Melnikova; Lakshmi Thangavelu; A. Surendar; Nikolay I. Repnikov; Zeinab Arzehgar
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