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Nurulakmal Mohd Sharif
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Journal Articles
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2022) 34 (1): 31–44.
Published: 28 July 2021
