This study aims to investigate soldering of SiC ceramics by using Zn-Al-In-based solders and ultrasonic soldering. The focus was on the quality of soldered joints, examining the boundary of the solder/substrate joint and the strength of the fabricated joints. Moreover, the fractured surfaces of joints were assessed.
The Zn-5Al base, which is considered for eutectic solder, was used in experiments. When manufacturing this solder, In was also added to at 1 Wt.%. The soldering of SiC substrates on a hot plate with ultrasonic assistance was performed.
The solder at room temperature consists of a primary segregated solid solution (Zn) and the binary eutectics (Zn) + (Al) with a high Al content and binary lamellar eutectic with a high Zn and In content non-uniformly distributed on the grain boundaries. The average tensile strength of the Zn5Al1In solder was 52 MPa. The ceramic material was wetted during soldering via reaction between the solder and the SiC substrate, with the formation of Al-Si reaction products. The thickness of the reaction layer on the boundary was 0.5–1.1 µm. The average strength of the soldered joint was 59 MPa. The obtained results confirmed the high efficiency of ultrasonic soldering in air.
This work has characterised Zn5Al1In soldering alloy and examining soldering SiC ceramics by a flux-less ultrasonic process. The analyses were oriented to assess the strength and structure of the solder and the soldered joints. Based on the achieved results, it is possible to predict the suitability of the solder alloy for flux-free soldering of SiC ceramics.
