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Journal Articles

Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications

Igor Kostolný, Roman Kolenak, Paulina Babincova, Martin Kusý

Soldering & Surface Mount Technology (2023) 35 (1): 28–34.

https://doi.org/10.1108/SSMT-02-2022-0012

Published: 29 April 2022

View article titled, Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications

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Journal Articles

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Kusý, Matej Pašák

Soldering & Surface Mount Technology (2019) 31 (2): 93–101.

https://doi.org/10.1108/SSMT-10-2018-0039

Published: 02 April 2019

View article titled, Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

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Journal Articles

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

Roman Kolenak

Soldering & Surface Mount Technology (2017) 29 (3): 121–132.

https://doi.org/10.1108/SSMT-08-2016-0018

Published: 05 June 2017

View article titled, Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

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Journal Articles

Direct bonding of silicon with solders type Sn-Ag-Ti

Roman Kolenak, Igor Kostolný, Martin Sahul

Soldering & Surface Mount Technology (2016) 28 (3): 149–158.

https://doi.org/10.1108/SSMT-11-2015-0040

Published: 06 June 2016

View article titled, Direct bonding of silicon with solders type Sn-Ag-Ti

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Journal Articles

Comparison study of SAC405 and SAC405+0.1%Al lead free solders

Roman Koleňák, Robert Augustin, Maroš Martinkovič, Michal Chachula

Soldering & Surface Mount Technology (2013) 25 (3): 175–183.

https://doi.org/10.1108/SSMT-Aug-2012-0018

Published: 21 June 2013

View article titled, Comparison study of SAC405 and SAC405+0.1%Al lead free solders

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Journal Articles

Characteristics and properties of Bi‐11Ag solder

Roman Koleňák, Michal Chachula

Soldering & Surface Mount Technology (2013) 25 (2): 68–75.

https://doi.org/10.1108/09540911311309022

Published: 05 April 2013

View article titled, Characteristics and properties of Bi‐11Ag solder

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Journal Articles

Wettability and shear strength of active Sn2Ti solder on Al₂O₃ ceramics

Roman Koleňák, Michal Chachula, Pavol Šebo, Monika Koleňáková

Soldering & Surface Mount Technology (2011) 23 (4): 224–228.

https://doi.org/10.1108/09540911111169066

Published: 20 September 2011

View article titled, Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics

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Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

Direct bonding of silicon with solders type Sn-Ag-Ti

Comparison study of SAC405 and SAC405+0.1%Al lead free solders

Characteristics and properties of Bi‐11Ag solder

Wettability and shear strength of active Sn2Ti solder on Al₂O₃ ceramics

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