Roman Kolenak
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Journal Articles

Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications

Igor Kostolný, Roman Kolenak, Paulina Babincova, Martin Kusý
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2023) 35 (1): 28–34.
https://doi.org/10.1108/SSMT-02-2022-0012
Published: 29 April 2022
View article titled, Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications
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Journal Articles

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Roman Koleňák, Igor Kostolný, Jaromír Drápala, Martin Kusý, Matej Pašák
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 93–101.
https://doi.org/10.1108/SSMT-10-2018-0039
Published: 02 April 2019
View article titled, Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder
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Journal Articles

Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition

Roman Kolenak
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (3): 121–132.
https://doi.org/10.1108/SSMT-08-2016-0018
Published: 05 June 2017
View article titled, Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition
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Journal Articles

Direct bonding of silicon with solders type Sn-Ag-Ti

Roman Kolenak, Igor Kostolný, Martin Sahul
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (3): 149–158.
https://doi.org/10.1108/SSMT-11-2015-0040
Published: 06 June 2016
View article titled, Direct bonding of silicon with solders type Sn-Ag-Ti
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Journal Articles

Comparison study of SAC405 and SAC405+0.1%Al lead free solders

Roman Koleňák, Robert Augustin, Maroš Martinkovič, Michal Chachula
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (3): 175–183.
https://doi.org/10.1108/SSMT-Aug-2012-0018
Published: 21 June 2013
View article titled, Comparison study of SAC405 and SAC405+0.1%Al lead free solders
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Journal Articles

Characteristics and properties of Bi‐11Ag solder

Roman Koleňák, Michal Chachula
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2013) 25 (2): 68–75.
https://doi.org/10.1108/09540911311309022
Published: 05 April 2013
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Journal Articles

Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics

Roman Koleňák, Michal Chachula, Pavol Šebo, Monika Koleňáková
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (4): 224–228.
https://doi.org/10.1108/09540911111169066
Published: 20 September 2011
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