This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied.
It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phases ɛ-Ti6Sn5 and Ti2Sn3 – were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 µm and ensures the wettability of an active solder on the surfaces of ceramic materials.
X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa.
The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.
