Issues

Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys

Mohammad Gharaibeh; Aaron J. Stewart; Quang T. Su; James M. Pitarresi
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Influence of thermal shock cycles on Sn-37Pb solder bumps

Guisheng Gan; Da-quan Xia; Xin Liu; Cong Liu; Hanlin Cheng; Zhongzhen Ming; Haoyang Gao; Dong-hua Yang; Yi-ping Wu
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Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Roman Koleňák; Igor Kostolný; Jaromír Drápala; Martin Kusý; Matej Pašák
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Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Wan Yusmawati Wan Yusoff; Norliza Ismail; Nur Shafiqa Safee; Ariffin Ismail; Azman Jalar; Maria Abu Bakar
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Characterization of SAC – x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly

Fakhrozi Che Ani; Azman Jalar; Abdullah Aziz Saad; Chu Yee Khor; Mohamad Aizat Abas; Zuraihana Bachok; Norinsan Kamil Othman
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Rheology of F620 solder paste and flux

Flavia V. Barbosa; José C.F. Teixeira; Senhorinha F.C.F. Teixeira; Rui A.M.M. Lima; Delfim F. Soares; Diana M.D. Pinho
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Design of a bi-manual haptic interface for skill acquisition in surface mount device soldering

Jose James; Bhavani Rao R.; Gabriel Neamtu
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