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Da-quan Xia
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Journal Articles
Influence of thermal shock cycles on Sn-37Pb solder bumps
Available to PurchaseGuisheng Gan, Da-quan Xia, Xin Liu, Cong Liu, Hanlin Cheng, Zhongzhen Ming, Haoyang Gao, Dong-hua Yang, Yi-ping Wu
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 85–92.
Published: 20 February 2019
